ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT

专利名称：ATTACHMENT MECHANISM FOR

ELECTRONIC COMPONENT

发明人：JUN-HUI WANG,KUN LI,AI-LING HE申请号：US13463830申请日：20120504

公开号：US20130176697A1公开日：20130711

专利附图：

摘要：An attachment mechanism for fastening an electronic component includes acircuit board and a fastener. The circuit board includes a first connector to connect with asecond connector of the electronic component. A mounting hole is defined beside the

first connector. The fastener includes a supporting plate. A bottom of the supportingplate includes a first protrusion abutting against a top of the circuit board, and a secondprotrusion deformably extending through the mounting hole to abut against a bottomof the circuit board. A top of the supporting plate includes a supporting protrusion. Apair of spaced engaging portions protrudes from a top of the supporting protrusion. Theengaging portions extend through the mounting hole to allow the electronic componentto be supported on the supporting protrusion.

申请人：JUN-HUI WANG,KUN LI,AI-LING HE

地址：Shenzhen City CN,Shenzhen City CN,Shenzhen City CN

国籍：CN,CN,CN

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